The effect of certain ions on the internal stress of bright copper electrodeposits

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dc.contributor.authorFigueroaJiménez,Manfredo
dc.date.accessioned2019-12-28T02:45:34Z
dc.date.available2019-12-28T02:45:34Z
dc.date.issued1979
dc.description.abstractThe effect of low concentrations (0 100 mg 1?1) of F, Cl, Br, I, As, Sb, Bi, Ni, Zn, Fe, Ag, Te, Se, Pb, and S on the internal stress of bright copper electrodeposits was studied. The following solution containing 30 mg 1?1 of thiourea as a brightening additive was used as the electrolyte: CuSO4 5H2O (225 g l?1), H2SO4 (60g l?1). It is shown that the internal stress of copper electrodeposits can be considerably reduced by addition of Se(IV), Cl, Br, or I to the above electrolyte.
dc.fuente.origenSpringer
dc.identifier.doi10.1007/BF00617557
dc.identifier.urihttps://repositorio.uc.cl/handle/11534/27149
dc.identifier.urihttp://link.springer.com/article/10.1007/BF00617557
dc.issue.numeroNo. 4
dc.language.isoen
dc.nota.accesoContenido parcial
dc.revistaJournal of Applied Electrochemistryes_ES
dc.rightsacceso restringido
dc.subject.ddc510
dc.subject.deweyMatemática física y químicaes_ES
dc.subject.otherElectroquímicaes_ES
dc.subject.otherElementos químicoses_ES
dc.subject.otherCobrees_ES
dc.titleThe effect of certain ions on the internal stress of bright copper electrodepositses_ES
dc.typeartículo
dc.volumenVol. 9
sipa.codpersvinculados97953
sipa.codpersvinculados48935
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