The effect of certain ions on the internal stress of bright copper electrodeposits
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Date
1979
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Abstract
The effect of low concentrations (0 100 mg 1?1) of F, Cl, Br, I, As, Sb, Bi, Ni, Zn, Fe, Ag, Te, Se, Pb, and S on the internal stress of bright copper electrodeposits was studied. The following solution containing 30 mg 1?1 of thiourea as a brightening additive was used as the electrolyte: CuSO4 5H2O (225 g l?1), H2SO4 (60g l?1). It is shown that the internal stress of copper electrodeposits can be considerably reduced by addition of Se(IV), Cl, Br, or I to the above electrolyte.