Electronic speckle pattern interferometry analysis of tensile tests of semihard copper sheets

Electronic speckle pattern interferometry analysis of tensile tests of semihard copper sheets

Files

Electronic speckle pattern interferometry analysis of tensile tests of semihard copper sheets.pdf(2.57 KB)

Date

2001

Authors

Vial Edwards, Cristián

Lira Canguilhem, Ignacio

Münzenmayer Schuller, Marcelo Andrés

Keywords

Electronic speckle pattern interferometry (ESPI), Tensile tests, Semihard copper sheets

URI

https://doi.org/10.1007/bf02323105
https://repositorio.uc.cl/handle/11534/65414

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