The effect of certain ions on the internal stress of bright copper electrodeposits

Abstract

The effect of low concentrations (0 100 mg 1?1) of F, Cl, Br, I, As, Sb, Bi, Ni, Zn, Fe, Ag, Te, Se, Pb, and S on the internal stress of bright copper electrodeposits was studied. The following solution containing 30 mg 1?1 of thiourea as a brightening additive was used as the electrolyte: CuSO4 5H2O (225 g l?1), H2SO4 (60g l?1). It is shown that the internal stress of copper electrodeposits can be considerably reduced by addition of Se(IV), Cl, Br, or I to the above electrolyte.